Laird Tputty 507 Thermal Putty Gap Filler

Laird Tputty 508 – Genuine Microsoft OEM Xbox Series X / S Thermal Putty, 30g Syringe

The exact material Microsoft sells as its official Xbox Series S replacement thermal paste: each Microsoft Store kit is a 1 ml syringe prefilled with Laird 508. This is the same green putty used at the factory between the heatsink and motherboard on the Series X and Series S, supplied here in a 30 gram syringe - roughly nine times the Microsoft kit and enough for several consoles.

Please note: the photo is for illustration only and does not show the actual syringe you will receive. We purchase Laird Tputty 508 in bulk directly and fill it into smaller 30g syringes ourselves, so your syringe may differ in appearance from the one pictured. The putty inside is genuine Laird 508.

Tputty 508 is a single-part, non-curing, ceramic-filled silicone gap filler. It flows to fill uneven gaps under the heatsink's own pressure, stays in place on vertical surfaces and puts minimal stress on components, which is why it replaces stacked thermal pads on the Xbox memory and power stages.

Specification (Laird datasheet A17223-00)
Thermal conductivity 3.7 W/mK.
Colour green. Density 3.2 g/cc.
Operating range −40 to 150 °C.
Minimum bond line 0.09 mm. Dielectric breakdown over 3000 VAC, electrically non-conductive. UL 94 V-0.
RoHS compliant.

Use
Xbox Series X and Series S putty replacement over the GDDR6 and VRM areas; also suitable for laptop and graphics card VRAM/VRM gap filling. It is a gap filler, not a die paste: use a conventional paste or Honeywell PTM7950 on the APU itself.

Application
Remove all old putty, dispense dots or beads in the factory positions and volume, reassemble. No cure time. Cap and store at room temperature.

You receive
One capped 30 gram syringe of genuine Laird Tputty 508, filled by us from bulk stock. Dispatched from the UK within one working day by Royal Mail.