Fehonda LTP81 Thermal Putty Gap Filler Liquid Thermal Pad, 18 W/mK

Fehonda LTP81 Thermal Putty Gap Filler – Liquid Thermal Pad, 18 W/m·K

Fehonda LTP81 is a high-conductivity liquid thermal pad, rated at 18.0 W/m·K. It replaces solid thermal pads on graphics card memory and power stages, laptops and other electronics. Because it takes the shape of the gap, you don't need to measure your old pads or hunt for their thickness, which often isn't published anywhere. Available in 12 g, 50 g and 100 g.

LTP81 is a single-component putty. It spreads under the heatsink's clamping pressure and forms a dense layer that makes full contact between the component and the cooler, even where the gaps are uneven. It contains no metal particles, won't corrode metal surfaces and is electrically insulating, so you can use it safely on any surface around the components.

Specification (Fehonda datasheet)
Thermal conductivity 18.0 W/m·K.
Density 3.85 ±0.2 g/cc (ASTM D792).
Hardness 15 ±3 Shore C (ASTM D2240).
Breakdown voltage over 9 kV/mm (ASTM D149).
Volume resistivity ≥10¹² Ω·cm (ASTM D257).
Operating range −40 to 180 °C.
UL 94 V-0.

Use
Graphics card VRAM and VRM, laptop memory and power stages, and other components where pads of different thicknesses would normally be stacked. It is a gap filler, not a die paste: use a conventional paste, liquid metal or PTM7950 on the CPU or GPU die itself.

Application
Remove all old pads or putty and clean the surfaces. Apply enough LTP81 to fill the gap with the included spatula. Reassemble and tighten the heatsink evenly.

You receive
One genuine Fehonda LTP81 in your chosen size (12 g, 50 g or 100 g). Supplied by Thermify, official UK distributor of Fehonda. Dispatched from the UK within one working day by Royal Mail.