Fehonda LP10 Liquid Metal Microcapsule Thermal Paste Electrically Non-Conductive, 100 W/mK

Fehonda LP10 Liquid Metal Microcapsule Thermal Paste – Electrically Non-Conductive, 100 W/m·K

Fehonda LP10 is a new kind of liquid metal thermal compound, rated at 100 W/m·K. The liquid metal is sealed inside microcapsules, so you get liquid-metal-level heat transfer without the usual risks. It doesn't leak, run or spread beyond where you apply it, and it is electrically non-conductive. Available in 1 g and 3 g.

Traditional liquid metal conducts electricity, so any spill onto surrounding components can short them. That's why it's usually applied with nail-varnish or tape barriers and only by experienced users. LP10 removes that risk. Because the metal stays locked inside the capsules, it behaves like a paste during application and in service, not like a free-flowing liquid.

Specification (Fehonda)
Thermal conductivity 100 W/m·K.
Electrically non-conductive.
Liquid metal microcapsule formulation, leak-resistant.
Colour grey.

Use
CPU and GPU dies, console APUs and laptop processors, anywhere you'd consider liquid metal but want to avoid the risk of short circuits. It is a die compound, not a gap filler: use thermal putty or pads on memory and power stages.

Application
Clean the die and heatsink with isopropyl alcohol. Apply LP10 either as a dot in the centre of the die or spread thinly and evenly across it. Reassemble and tighten the heatsink evenly.

You receive
One genuine Fehonda LP10 syringe in your chosen size (1 g or 3 g). Supplied by Thermify, official UK distributor of Fehonda. Dispatched from the UK within one working day by Royal Mail.